The Cadence® Sigrity™ PowerDC™ environment provides fast and accurate DC analysis for IC packages and PCBs along with thermal analysis that also supports electrical and thermal co-simulation. Targeting both pre- and post-layout applications, the Sigrity PowerDC approach enables you to quickly identify IR drop, current density, and thermal issues that are among the leading field failure risks. Powerful features, including sense line location optimization and simplified design-rule checker (DRC) confirmation, work in concert with the fastest available simulation to support design improvements without excess cost and schedule impacts.
Most Recent Flipbooks
Rapidly model full IC packages or full PCBs without power and ground planes using quasi-static solver technology
Using models created with XtractIM, you can quickly assess package electrical characteristics and perform system-level signal and power integrity simulations.
With a unique combination of frequency domain, time domain, and statistical analysis techniques, you can be confident of achieving robust parallel bus and serial link interface implementations.
Combines circuit solver and transmission line solver with a fast electromagnetic (EM) field solver to capture dynamic interactions between signal, power, and ground on signals and planes.
The Cadence® Sigrity™ PowerSI® environment provides fast and accurate full-wave electrical analysis of leading-edge IC packages and PCBs to overcome increasingly challenging design issues.
Fully explore the feasible design space and identify a range of candidate decap implementations, enabling users to pinpoint the ideal approach.