Utilize these techniques to create reliable, powerful and compact designs and ensure the success of your HD...
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This article explains ball grid array parts used in the design of circuit boards and discusses some best practice PCB layout recommendations for BGA packages.
The Cadence® Allegro® PCB Editor helps bring your innovative and bleeding-edge designs to life.
The continuing saga of doing more with less in order to compete in the electronics hardware market
This article discusses the problems of managing high-density vias in an HDI PCB design, as well as offering some potential management solutions.
This article is about Vertical Conductive Structures (VeCS) and how they are used to benefit high-density routing in a printed circuit board design.
SerDes in FPGA minimizes the number of input/output pins and connections while providing data transmission over a differential or single line.
As our electronics do more for us, we must do more to integrate the functions into higher density designs
Utilize these techniques to create reliable, powerful and compact designs and ensure the success of your HDI projects.
Utilize embedded components for shorter signal paths, increased performance and reduced PCB size.
By setting up your HDI rules, you can easily fit more parts per board area and pack more power into smaller form factors.
To better understand the differences in PCB layout between a double sided board and a multilayer board, take a look at this multilayer PCB design tutorial.
The whole world gets a little smaller and a little faster every other day. The underlying magic that supports this flow of knowledge is constantly evolving to keep up.
This user guide describes these key aspects of HDI requirements and the tool features supporting HDI design methodology.
HDI routing requires understanding of tight component layout, EMI interactivity, and current flow distribution