The Cadence® Sigrity™ PowerSI® environment provides fast and accurate full-wave electrical analysis of leading-edge IC packages and PCBs to overcome increasingly challenging design issues such as simultaneous switching noise (SSN), signal coupling, problematic decoupling capacitor implementations, and design regions that are under or over target voltage levels. The Sigrity PowerSI approach can be used before layout to develop power integrity (PI) and signal integrity (SI) guidelines as well as post-layout to verify performance and improve designs without a physical prototype. PowerSI capabilities can be readily used in popular PCB, IC package, and system-in-package (SiP) design flows.
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Avoid power delivery network problems on your circuit board by clearly understanding power integrity fundamentals.
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An examination of the key design rules for PCB layout, and how these rules should be used within a PCB design CAD system.
To help control thermal problems in a PCB design, it is important to understand via stitching for high current traces.
Learn about the common compromises when it comes to designing a PCB.
This article examines PCB component orientation problems and why part rotations are important both electrically and for manufacturability.
This article is about different PCB component placement defect detection methods you can use to avoid common DFM errors.
This article discusses the importance of maintaining PCB creepage and clearance standards in your circuit board layout and methods for accomplishing that.
This article will explore the differences between single-ended and differential signals and show you how to use each to your advantage in your designs.
Notes on why it's important for component placement to meet assembly requirements.