Integrated SI Analysis, Optimization, and Signoff of a 3D-IC System with Cadence Multi-Physics System Solvers

Join our experts to understand the challenges introduced by 3D-ICs in system-level signal integrity (SI) signoff. Learn how to build out 3D-IC topologies, do model extraction of interposers, including complex cross-fabric components, and analyze SI of the whole system without any scalability issues using the same leading-edge technologies from Cadence that are empowering the most complex designs being created.

Learn more about Cadence 3D-IC and hyperscale computing solutions.