Advances in EM Analysis and Design Flows for RF System Development
Learn how the Cadence design platforms address the growing problem of increased electromagnetic (EM) coupling and electrothermal concerns in densely packed electronics by providing seamlessly...
Read this Whitepaper to learn how the Cadence design and analysis platforms address the growing problem of increased electromagnetic (EM) coupling and electrothermal concerns in densely packed electronics by providing seamlessly integrated EM and multi-physics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board.
Leading electronics providers rely on Cadence products to optimize power, space, and energy needs for a wide variety of market applications. Unlock the potential of our Multiphysics System Analysis solutions tailored to your needs.