Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro® and Sigrity™ packaging and PCB design domains. This technology provides a seamless and automated design flow between IC, package, and PCB design that can accelerate the overall design process and minimize errors.
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