Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages

October 18, 2018 Cadence PCB Solutions

Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro® and Sigrity™ packaging and PCB design domains. This technology provides a seamless and automated design flow between IC, package, and PCB design that can accelerate the overall design process and minimize errors. 

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Cadence PCB solutions is a complete front to back design tool to enable fast and efficient product creation. Cadence enables users accurately shorten design cycles to hand off to manufacturing through modern, IPC-2581 industry standard.

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