Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, PCBs, and Packages
Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro®...
Fill form to unlock content
Loading, please wait
Error - something went wrong!
Fill Out the Form to Access the White Paper
Thank you!
Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro® and Sigrity™ packaging and PCB design domains.