Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, PCBs, and Packages
Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro®...
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Cross-domain co-design and co-analysis capabilities are provided by the Cadence Virtuoso System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro X and Sigrity packaging domains.