Intelligently Managing 3D-IC Timing Signoff
In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner...
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While the benefits to 3D-IC technology are significant, timing analysis of synchronous paths across dies of different process nodes presents new challenges. In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner count and design size.