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Intelligently Managing 3D-IC Timing Signoff

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In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner...

While the benefits to 3D-IC technology are significant, timing analysis of synchronous paths across dies of different process nodes presents new challenges. In this white paper, we will present the Tempus Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner count and design size.