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3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing. While there’s interest in 3D-ICs, it’s still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this white paper to learn about 3D integration and packaging of multiple stacked dies, design challenges, ecosystem requirements, and needed solutions.