Electrical-Thermal Co-simulation of 3D-IC Structures Using Celsius Thermal Solver

February 2, 2021

This pre-recorded webinar explains the forces driving electronics designers to utilize advanced 3D packaging methods and shows an analysis of a System on Integrated Chips (SoIC) design. Temperature profiles are plotted for thermal, electrothermal, and transient behaviors using the Celsius™ Thermal Solver.

Electrical-Thermal Co-simulation of 3D-IC Structures Using Celsius Thermal Solver

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