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System-Driven PPA for Multi-Chiplet Designs

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This white paper discusses the need, challenges, and solutions for 3D-IC design and analysis achieved with the Cadence® Integrity™ 3D-IC platform—the industry’s first integrated solution for...

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This white paper discusses the need, challenges, and solutions for 3D-IC design and analysis achieved with the Cadence Integrity 3D-IC platform—the industry’s first integrated solution for system planning, implementation, and system-level analysis.