eBook: 3D Packaging vs 3D Integration
In this eBook we explore the background of multi-chip packaging, delve into the trends of heterogeneous integration and multi-die packages, and address design and analysis challenges.
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3DIC Collateral
This Stream includes all of our 3DIC Collateral Flipbooks
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Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
Read about market demand for new heterogenous, chiplet-based architectures and the system-level design methodologies required.
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An EDA perspective on advanced semiconductor packaging
Overview of trends for foundry-based 2.5D-IC, 3D-IC, and FOWLP packaging, including the benefits of a modernized design flow.
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3D-IC Design Challenges and Requirements
3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing.
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Integrity 3D-IC Platform
Provides an industry-first holistic and comprehensive 3D-IC design planning, implementation, and analysis platform.
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System-Driven PPA for Multi-Chiplet Designs
This white paper discusses the need, challenges, and solutions for 3D-IC design and analysis achieved with the Cadence® Integrity™ 3D-IC platform—the industry’s first integrated solution for...
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mmWave Chip, Package, and Board Beamforming Solutions
RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization are taking place with...
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Intelligently Managing 3D-IC Timing Signoff
In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner...
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Advances in EM Analysis and Design Flows for RF System Development
Learn how the Cadence design platforms address the growing problem of increased electromagnetic (EM) coupling and electrothermal concerns in densely packed electronics by providing seamlessly...
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Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, PCBs, and Packages
Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro®...
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How to Speed Up Large-Scale EM Simulation of ICs Without Compromising Accuracy
With growing on-chip radio frequency (RF) content, electromagnetic (EM) simulation of the passives is critical for a variety of reasons—from selecting the right RF design candidates to detecting...
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Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact...
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OrbitIO Interconnect Designer
Cadence® OrbitIO™ interconnect designer revolutionizes the cross-substrate interconnect architecting, assessment, implementation, and optimization process by unifying IC, package, and PCB data...
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EMX Planar 3D Solver
The Cadence® EMX® Planar 3D Solver is an electromagnetic simulator for high-frequency, RF, and mixed-signal integrated circuits. It allows designers to accurately and efficiently simulate large...
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