Cadence PCB success stories

Faraday Technology and Cadence

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Cadence Design Systems enables global electronic design innovation and plays an essential role in the creation of today's electronics. Customers use Cadence software, hardware, IP, and expertise to design and verify today's mobile, cloud and connectivity applications. www.cadence.com © 2013 Cadence Design Systems, Inc. All rights reserved. Cadence, the Cadence logo, Encounter, First Encounter, Incisive, and Sigrity are registered trademarks of Cadence Design Systems, Inc. All others are properties of their respective holders. 1702 11/13 CY/ LX / PDF Results To fulfill the three major concerns of "partition, integration, and efficiency", Faraday successfully achieved the completion of its 300-million-gate SoC project within seven months and entered into mass production. As Faraday also provides back-end manufacturing services on this chip, the company paid much attention to building a co-design environment from IC to packaging and PCB design. The co-design infrastructure aims to resolve the SI/power integrity (PI) issues. All these efforts have greatly increased front-end design efficiency and improved yield rate of manufacturing effectively. Other than front-end functional verification and back-end placement-and-routing design, Faraday was able to reduce design time for its hierarchical formal check, IR drop analysis, packaging, and PCB power analysis processes with the help of the Cadence team and its professional chip design process. For Faraday, it is a resounding success, and realizes a 10X leap in design capacity. Summary and Future Plans Wu expressed that, besides the superior design ability and experience vs. other competitors, excellent integration and management were the two main factors for the success of this project. This effort also fully demonstrates that Taiwanese businesses are able to take on more complex and larger-scale design projects. At the same time, with the expanding communications industry, large-size chip design needs are anticipated to increase. There is also the trend of the billion-gate SoC. Eyeing the great potential, Faraday will continuously deploy design capabilities based on its successful experiences on the 300-million-gate SoC design and be ready to undertake larger projects. Faraday also knows that relying on design service providers alone is no longer enough to fulfill customers' needs. Thus, during this project, the support and assistance provided by the Cadence team was critical. In the future, Faraday will further enhance its relationships with EDA and IP partners, and together, be able to take on more difficult design projects.

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