Cadence PCB Best Practices

Working with Real-Time DFA Analysis

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© 1991–2019 Cadence Design Systems, Inc. All rights reserved. Portions © Apache Software Foundation, Sun Microsystems, Free Software Foundation, Inc., Regents of the University of California, Massachusetts Institute of Technology, University of Florida. Used by permission. Printed in the United States of America. Cadence Design Systems, Inc. (Cadence), 2655 Seely Ave., San Jose, CA 95134, USA. Allegro PCB Editor contains technology licensed from, and copyrighted by: Apache Software Foundation, 1901 Munsey Drive Forest Hill, MD 21050, USA © 2000-2005, Apache Software Foundation. Sun Microsystems, 4150 Network Circle, Santa Clara, CA 95054 USA © 1994-2007, Sun Microsystems, Inc. Free Software Foundation, 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA © 1989, 1991, Free Software Foundation, Inc. Regents of the University of California, Sun Microsystems, Inc., Scriptics Corporation, © 2001, Regents of the University of California. Daniel Stenberg, © 1996 - 2006, Daniel Stenberg. UMFPACK © 2005, Timothy A. Davis, University of Florida, ( Ken Martin, Will Schroeder, Bill Lorensen © 1993-2002, Ken Martin, Will Schroeder, Bill Lorensen. Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts, USA © 2003, the Board of Trustees of Massachusetts Institute of Technology. All rights reserved. Trademarks: Trademarks and service marks of Cadence Design Systems, Inc. contained in this document are attributed to Cadence with the appropriate symbol. For queries regarding Cadence's trademarks, contact the corporate legal department at the address shown above or call 800.862.4522. Open SystemC, Open SystemC Initiative, OSCI, SystemC, and SystemC Initiative are trademarks or registered trademarks of Open SystemC Initiative, Inc. in the United States and other countries and are used with permission. All other trademarks are the property of their respective holders. Restricted Permission: This publication is protected by copyright law and international treaties and contains trade secrets and proprietary information owned by Cadence. Unauthorized reproduction or distribution of this publication, or any portion of it, may result in civil and criminal penalties. Except as specified in this permission statement, this publication may not be copied, reproduced, modified, published, uploaded, posted, transmitted, or distributed in any way, without prior written permission from Cadence. Unless otherwise agreed to by Cadence in writing, this statement grants Cadence customers permission to print one (1) hard copy of this publication subject to the following conditions: 1. The publication may be used only in accordance with a written agreement between Cadence and its customer. 2. The publication may not be modified in any way. 3. Any authorized copy of the publication or portion thereof must include all original copyright, trademark, and other proprietary notices and this permission statement. 4. The information contained in this document cannot be used in the development of like products or software, whether for internal or external use, and shall not be used for the benefit of any other party, whether or not for consideration. Disclaimer: Information in this publication is subject to change without notice and does not represent a commitment on the part of Cadence. Except as may be explicitly set forth in such agreement, Cadence does not make, and expressly disclaims, any representations or warranties as to the completeness, accuracy or usefulness of the information contained in this document. Cadence does not warrant that use of such information will not infringe any third party rights, nor does Cadence assume any liability for damages or costs of any kind that may result from use of such information. Restricted Rights: Use, duplication, or disclosure by the Government is subject to restrictions as set forth in FAR52.227-14 and DFAR252.227-7013 et seq. or its successor.

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