HDI PCB Design

Your ultimate resource for HDI Via Design in PCBs! Dive into expert tips, best practices, and innovative techniques for designing efficient, reliable, and high-performance PCBs.

Getting Started

17 days ago

Designing HDI in Allegro X

Discover a complete HDI design workflow in Allegro X, covering constraints, stackups, BGA breakout strategies, microvia configurations, and SI/PI validation for precise results.

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2 months ago

HDI Deconstructed

Explore HDI PCB design with our guide. Learn about microvia physics, materials, and reliability to optimize your high-density layouts. Download today.

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16 days ago

Top 10 Emerging Trends in High-Density Interconnect (HDI) Design

Discover the top 10 trends in HDI design, including microvias, AI automation, and sustainable methods. Learn cutting-edge techniques shaping the future of high-density interconnect technology

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Blogs

about 1 month ago

Why Decoupling Capacitor Placement Becomes Harder in HDI PCB Designs

Discover why decoupling capacitor placement becomes a critical challenge in HDI PCB designs. Learn how to overcome constraints like fine-pitch BGAs, stacked microvias, and PDN complexities for optimal

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about 1 month ago

What is Thermal Design in HDI? Managing Heat in Ultra-Thin Dielectrics and Microvia-Dense Regions

Learn how to optimize thermal design in High Density Interconnect (HDI) PCBs. Explore microvia thermal fields, copper balancing, and heat spreading.

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about 1 month ago

The Physics of Resin Flow: Glass Weave Locking & Dielectric Behavior in HDI Laminations

Understand HDI PCB design by tackling resin flow, glass weave, and dielectric behavior. Prevent defects like voids, skew, and delamination in high-density stackups

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about 1 month ago

Architecting HDI for Ultra-Fine-Pitch Chiplets, AI Accelerators, and Fan-Out Packaging on Boards

Learn how to route 0.355 mm BGA pitches and design high density interconnect (HDI) PCBs for AI accelerators. Explore stackups, sub-3-mil routing, stacked microvias, and thermal management techniques.

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about 1 month ago

Return Path Integrity in HDI Designs: How Microvias Reshape High-Speed Current Flow

Learn how HDI PCBs and microvias reshape high-speed signal return paths. Discover critical stitching strategies for DDR5, PCIe Gen5/6, and USB4 to maintain signal integrity in dense BGAs.

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3 months ago

Why HDI Designs Fail in the Field: Advanced Root Causes Beyond Standard Microvia Cracking

Prevent HDI PCB failures with insights on resin starvation, copper pull-away, and CAF growth. Ensure long-term reliability using Cadence DFM solutions.

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3 months ago

Does HDI Improve Signal Integrity? The Real Electromagnetic Impact of Microvias

HDI promises better signal integrity, but does it deliver? Learn the real electromagnetic impact of microvias, via stubs, differential skew, and reference plane issues in high-speed PCB design.

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3 months ago

Electromagnetic Side Effects of HDI: Cavity Modes, Return-Path Fragmentation, and Plane Resonance Patterns

Explore electromagnetic challenges in HDI PCB design, like cavity modes and plane resonance, and learn how advanced EM tools help solve signal integrity and EMI issues. For PCB and hardware engineers.

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2 months ago

How Many Microvias Can You Safely Stack? A Deep Dive Into HDI Reliability Physics

Discover how stacking microvias impacts HDI density and reliability. Cadence explores thermal stress, CTE mismatch, and material choices to guide PCB engineers on safe stack heights for durable design

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Videos

about 1 month ago

Will Your Microvias Survive? The Physics of Stacking, Aspect Ratios, and Copper Balance in HDI

A lot of engineers stack micro vias two or three layers deep to break out a dense BGA without ever really knowing whether those structures are going to survive the fabrication process. The design look

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about 1 month ago

Every Via Transition Is a Return Path Problem. Here's What Happens When You Ignore It.

That's what this video is about. At high frequencies anything above a few hundred megahertz, which includes DDR5, PCIe Gen 5, and USB the return current doesn't spread across the ground plane looking

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about 1 month ago

How HDI Via Density Can Break Your Power Planes

Standard DRCs won’t flag power delivery failures that may be present in your HDI PCB. When you break out a dense BGA, every microvia introduces an anti-pad into your power and ground planes. For a 0.4

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about 1 month ago

Are Your HDI Vias Carrying Current You Think They Are?

Designing an HDI PCB for AI accelerator applications? Signal integrity alone isn't enough. If your microvias can't deliver the power, your design is set up to fail. In this video, we walk through a tw

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2 months ago

How to Prevent HDI Fabrication Failures with Proper Via Constraints in Allegro X

Learn to configure HDI via rules in Allegro X. Explore spacing constraints, stacked microvia limits, copper spacing, and alignment to ensure manufacturable, reliable designs for high-speed HDI PCBs.

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2 months ago

HDI BGA Fanout Techniques Via-in-Pad, Stacked Microvias, and Ground Stitching in Allegro X

Learn BGA escape routing strategies for HDI PCB designs. Discover fanout, via-in-pad, and layer transitions in Allegro X to optimize signal integrity, manufacturability, and performance.

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2 months ago

How to Set Up Microvias and Blind Buried Vias in Allegro X for HDI

Learn how via selection impacts HDI and high-speed PCB designs. Explore microvias, blind, and buried vias for signal integrity, EMI, and manufacturability in Allegro X.

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