OrCAD datasheets

OrCAD ® PCB SI delivers powerful simulation technology to help you find and address signal integrity issues throughout the design process—from conceptual circuit design in the schematic to board placement and routing. It enables pre- and post-layout topology exploration, signal analysis, and validation, allowing you to increase circuit reliability and drive known-good inter- connect requirements throughout the PCB design flow to help reduce re-spins. Overview Addressing your signal quality challenges, inherent in today's electronic designs, is no longer relegated to just the high-end, high-speed signal integrity experts. With modern IC technology continuing to shrink, faster and faster edge rates are causing signal integrity issues to arise even in PCB designs generally not considered to be affected with "high-speed" problems or designs operating at traditionally "low" frequencies. As a result, circuit topology exploration, signal analysis, constraint development, and validation have all become essential parts of electronic product design. OrCAD PCB SI provides powerful signal integrity tools and enables an integrated flow to explore, identify, and manage issues. Beginning in the schematic stage with pre-layout circuit simulation, you can explore and eliminate signal integrity problems early in the design process. In addition, you can follow critical nets through to the board layout with simulation to analyze and validate interconnect signal integrity during and after placement and routing. Features Analysis OrCAD PCB SI's simulation technology provides powerful analysis capabilities to indentify a wide array of signal quality issues you might face such as reflection, overshoot and undershoot, ringing, coupling, delay, and many more. The technology includes a lossy, frequency-dependent transmission-line model that accurately predicts the distributed behavior of PCB traces up to several gigahertz. An integrated electrical field solver determines the electrical characteristics of routed etch and creates electrical models of PCB vias. Pre- and post-layout flows between schematic design and physical layout with OrCAD PCB SI enable signal integrity explo- ration and analysis at any stage of the design cycle. Having indentified signal performance or quality issues, the OrCAD PCB Highlights • Pre- and post-layout capabilities enable signal integrity exploration and analysis at any stage of the design cycle • Exploration, analysis, and design of interconnect topologies help increase circuit reliability, improve circuit performance, and reduce prototypes and re-spins • Direct integration with OrCAD PCB Editor and OrCAD Capture eliminates the need to translate design databases for simulation • Analysis results can be converted into embedded constraints to drive known-good interconnect requirements throughout the design flow • Support for all the latest industry-standard IBIS formats and models, generic models, and custom- built models speeds time to simulation • Proven, scalable, signal integrity exploration and validation solution that grows as design challenges and requirements evolve OrCAD PCB SI Pre- and post-layout topology exploration and signal integrity analysis

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