Practical Tips for PDN Design
f
Use Multiple Ground Planes: Dedicated ground planes in the stackup help contain noise and provide a stable reference
voltage for high-speed components.
f
Optimize Via Placement: Placing stitching vias near high-speed ICs reduces ground bounce and ensures even power distri-
bution.
f
Simulate Early and Often: Perform PDN analysis as part of the design process to catch potential issues early, making it
easier to adjust the layout and capacitor placement as needed.
High-Speed PCB Layout Design
Effective layout design is essential in high-speed PCBs, as it directly impacts signal integrity, EMI, and power stability. Key
layout considerations include strategic component placement, high-level routing techniques, and careful management of
signal return paths and vias.
Key Component Placement Strategies
In high-speed designs, component placement affects signal paths, noise coupling, and power distribution. Placing compo-
nents strategically minimizes signal integrity issues and optimizes performance.
1. Position High-Speed Components Near Their Connections:
f
Place critical components like microcontrollers, memory modules (e.g., DDR), and interfaces (e.g., HDMI) close to each
other to reduce trace lengths and avoid unnecessary signal paths.
f
Example: Place the processor near memory components to minimize delay and simplify routing for data and clock lines.
18 www.cadence.com
OrCAD X High-Speed Digital Design Guide
