Issue link: https://resources.pcb.cadence.com/i/1534337
Power Integrity In high-speed PCB designs, maintaining power integrity is essential to ensure stable and noise-free power delivery across the board. An effective Power Distribution Network (PDN) design minimizes fluctuations, reduces noise, and maintains voltage stability, allowing high-speed components to function optimally. Overview of Power Distribution Network (PDN) Design The PDN supplies stable voltage levels to all active components while managing power noise and minimizing impedance across the board. A well-designed PDN provides a low-impedance path from the power source to each component, ensuring smooth and consistent power flow, even during high-speed switching events. Typical PDN design elements include: f Power and Ground Planes: Dedicated planes in the PCB stackup for power and ground reduce impedance and provide an effective path for current flow. f Decoupling Capacitors: Placed strategically near high-speed ICs, decoupling capacitors filter high-frequency noise, stabilizing voltage levels. f Stitching Vias: Connecting power and ground planes across layers helps reduce ground bounce and ensures even voltage distribution. Key Causes of PDN Noise PDN noise can arise from several factors, particularly in high-speed applications where rapid switching causes voltage fluctuations. Here are some common sources: f Ground Bounce: When multiple ICs switch simultaneously, it creates fluctuations in the ground potential, leading to noise in the PDN. f Simultaneous Switching Noise (SSN): High-speed digital signals, such as clock signals or data lines, can introduce noise due to large numbers of transistors switching at once, affecting power stability. f Inductive Effects: Vias, connectors, and power planes introduce inductance into the PDN. This can cause voltage spikes or drops, particularly during high-speed operation. Simplified Design and Analysis Methods To ensure power integrity, designers use a combination of target impedance strategies, careful decoupling capacitor placement, and PDN analysis tools. Here's a simplified approach to PDN design and analysis: 1. Target Impedance: f Definition: Target impedance is the maximum PDN impedance allowed for a specific frequency range to prevent voltage fluctuations. f Implementation: Calculate the target impedance based on current requirements and acceptable voltage ripple for the design. A lower target impedance supports higher power stability, especially in high-speed designs. 2. Decoupling Capacitors: f Purpose: Decoupling capacitors act as local energy reservoirs, filtering out high-frequency noise and stabilizing voltage levels near high-speed components. f Placement Strategy: ɢ Place capacitors as close as possible to the power pins of ICs, with smaller-value capacitors closest to the pins to filter higher frequencies. ɢ Use a combination of different capacitance values (e.g., 0.01 µF, 0.1 µF, and 10 µF) to cover a broad frequency range. f Practical Tip: The room property for components allows you to optimize capacitor placement, ensuring effective noise reduction. For full power solutions, consider Cadence Celsius PowerDC. 17 www.cadence.com OrCAD X High-Speed Digital Design Guide
