OrCAD X Resources

f Text overlap f Text under component f Text to line f Text to shape f Text to text Impact: There is risk with having silkscreen in the wrong areas, though, like close to or under pads. There can be slivers and fabrication and manufacturing defects created by misplaced silkscreen. In addition, if the silk screen is missing in critical areas, it can significantly or gradually add on more cost for assembly. Where to Find: 1. In the constraint manager, navigate to the Manufacturing > Design for Fabrication > Silkscreen worksheet. 2. Then hit the button to create a new constraint set. That gets created. 3. Then populate the values based on what your design and manufacturer need (see image below). 4. Once the constraints are set, you are ready to apply them. 5. Go to Manufacturing > Design for Fabrication > Design > Silkscreen. 6. Click and apply your constraint set onto the cell next to your PRIMARY design. While we have constraints for all fabrication and assembly concerns, we need another for testing and test points. This is addressed in the next section. 39 www.cadence.com OrCAD X Constraint Management Guide

• Cover
• Part 2 - Standard Constraints
• Physical and Spacing Constraints
• Trace Width: Minimum and Maximum Width for Signal And Power Traces.
• Via Size: Diameter and pad size for vias, including microvias and blind/buried vias.
• Differential Pairs (Basic Setup)
• Creating a Diff Pair
• Spacing Constraints
• Creepage and Clearance: Minimum Distances Between Conductive Elements to Prevent Electrical Arcing
• Component Spacing: Minimum Distances Between Components to Avoid Interference and Facilitate Cooling
• Manufacturing Constraints
• Fabrication Tolerances: Allowable Variations in Dimensions for Manufacturing
• Board Outline Dimensions: Tolerances for Overall Board Size and Shape
• Trace Width for Manufacturing: Minimum Copper Width for Traces
• Trace Spacing: Minimum Distance Between Copper Features
• Annular Ring: Minimum Width of Copper Surrounding a Hole
• Drill to Copper Spacing
• Teardrops (Fillets)
• Pad To Mounting Hole Spacing: Minimum Distance Between Pads and Mounting Holes
• Acid Traps: Avoiding Acute Angles in Copper Features That Can Trap Etching Chemicals
• Minimum Copper Area: Smallest Allowable Area of Isolated Copper Features
• Assembly Constraints: Rules for Component Placement, Orientation, and Soldering
• Outlines and Cut Outs
• Where to Apply the Constraint Set
• Package to Package Spacing
• Component Spacing to PCB Features
• Pastemask
• Silkscreen and Solder Mask: Specifications for Text and Mask Application on The PCB.
• Design for Test (DFT) Constraints
• Test Points: Placement and Minimum Distances From Other Test Points and Components
• 3D Constraints
• Rigid Flex PCB Constraints
• Teardrops (Fillets)
• Component to Flex PCB
• Conclusion