OrCAD X Resources

OrCAD X Constraint Management Guide Part 2 of 5 DESIGN GUIDE

• Cover
• Part 2 - Standard Constraints
• Physical and Spacing Constraints
• Trace Width: Minimum and Maximum Width for Signal And Power Traces.
• Via Size: Diameter and pad size for vias, including microvias and blind/buried vias.
• Differential Pairs (Basic Setup)
• Creating a Diff Pair
• Spacing Constraints
• Creepage and Clearance: Minimum Distances Between Conductive Elements to Prevent Electrical Arcing
• Component Spacing: Minimum Distances Between Components to Avoid Interference and Facilitate Cooling
• Manufacturing Constraints
• Fabrication Tolerances: Allowable Variations in Dimensions for Manufacturing
• Board Outline Dimensions: Tolerances for Overall Board Size and Shape
• Trace Width for Manufacturing: Minimum Copper Width for Traces
• Trace Spacing: Minimum Distance Between Copper Features
• Annular Ring: Minimum Width of Copper Surrounding a Hole
• Drill to Copper Spacing
• Teardrops (Fillets)
• Pad To Mounting Hole Spacing: Minimum Distance Between Pads and Mounting Holes
• Acid Traps: Avoiding Acute Angles in Copper Features That Can Trap Etching Chemicals
• Minimum Copper Area: Smallest Allowable Area of Isolated Copper Features
• Assembly Constraints: Rules for Component Placement, Orientation, and Soldering
• Outlines and Cut Outs
• Where to Apply the Constraint Set
• Package to Package Spacing
• Component Spacing to PCB Features
• Pastemask
• Silkscreen and Solder Mask: Specifications for Text and Mask Application on The PCB.
• Design for Test (DFT) Constraints
• Test Points: Placement and Minimum Distances From Other Test Points and Components
• 3D Constraints
• Rigid Flex PCB Constraints
• Teardrops (Fillets)
• Component to Flex PCB
• Conclusion