OrCAD X Resources

Purpose: Pastemask is extremely important for automatic assembly of components onto your PCB. Solder paste is metallic material with a moderately high melting point used to adhere the components to a PCB copper pad surface using wave soldering or an oven. The paste mask is a film manufactured to create a negative image to squeegee the solder paste onto your PCB (for surface mount soldering preparation). You can set constraints for various paste mask options including: f Pastemask to pad f Missing pastemask f Pastemask to other mask types f Pastemask to ɢ Pastemask ɢ Via pad ɢ Other Mask ɢ Component Body To access, create, and apply paste mask rules onto your design: 1. Open the constraint manager and you'll find your constraint creation options under Manufacturing > Design for Assembly > Pastemask. 2. You can click to make your DFAMCS1 constraint, set your required values as per your manufacturing requirements and tolerances (see below). 3. Once that constraint has been created, apply it to your design that has paste mask layers. For example, the section below: Manufacturing > Design for Assembly > Design > Pastemask. 37 www.cadence.com OrCAD X Constraint Management Guide

• Cover
• Part 2 - Standard Constraints
• Physical and Spacing Constraints
• Trace Width: Minimum and Maximum Width for Signal And Power Traces.
• Via Size: Diameter and pad size for vias, including microvias and blind/buried vias.
• Differential Pairs (Basic Setup)
• Creating a Diff Pair
• Spacing Constraints
• Creepage and Clearance: Minimum Distances Between Conductive Elements to Prevent Electrical Arcing
• Component Spacing: Minimum Distances Between Components to Avoid Interference and Facilitate Cooling
• Manufacturing Constraints
• Fabrication Tolerances: Allowable Variations in Dimensions for Manufacturing
• Board Outline Dimensions: Tolerances for Overall Board Size and Shape
• Trace Width for Manufacturing: Minimum Copper Width for Traces
• Trace Spacing: Minimum Distance Between Copper Features
• Annular Ring: Minimum Width of Copper Surrounding a Hole
• Drill to Copper Spacing
• Teardrops (Fillets)
• Pad To Mounting Hole Spacing: Minimum Distance Between Pads and Mounting Holes
• Acid Traps: Avoiding Acute Angles in Copper Features That Can Trap Etching Chemicals
• Minimum Copper Area: Smallest Allowable Area of Isolated Copper Features
• Assembly Constraints: Rules for Component Placement, Orientation, and Soldering
• Outlines and Cut Outs
• Where to Apply the Constraint Set
• Package to Package Spacing
• Component Spacing to PCB Features
• Pastemask
• Silkscreen and Solder Mask: Specifications for Text and Mask Application on The PCB.
• Design for Test (DFT) Constraints
• Test Points: Placement and Minimum Distances From Other Test Points and Components
• 3D Constraints
• Rigid Flex PCB Constraints
• Teardrops (Fillets)
• Component to Flex PCB
• Conclusion