Allegro/OrCAD Rigid Flex Design Creation Best Practices
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pastemask and soldermask layer for the padstack are adjusted as well. The symbol Geometry is also
adjusted to accommodate the move from the TOP and BOTTOM layer geometries.
In the following example, an SMD resistor is placed on the bottom-most edge of a stackup zone where
layer INT_4 is the bottommost layer. The details in the Show Element window indicate that the
component is placed on layer INT_4.
Co m po nent P laced in a Stackup Zo ne
The details also indicate that the new subclass location for the reference designator is now
REFDES/Assembly_INT_4.
The component PACKAGE GEOMETRY/TOP is moved to the EMBEDDED GEOMETRY/ASSEMBLY_INT_4
subclass.
