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Tech Clarity - Managing Work in Progress in Electrical Design
EDM creates the opportunity to help manage the overall electrical design process in addition to helping individual designers and managing design processes. Centrally aggregated WIP designs contain...
Power Integrity in System Design
As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.
Using Power Aware IBIS v5.0 Behavioral IO Models to Simulate Simultaneous Switching Noise
Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.
The Facts about the Input Impedance of Power and Ground Planes
Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.
Timing Skew Enabler Induced by Fiber Weave Effect
This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).
The Application of IBIS-AMI Model Cascaded Simulation for 10 Gigabit Repeater Serial Link Analysis
Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression
Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces
This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.
Power Integrity Conference Paper
Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation
Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages
This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.
IBIS-AMI for SerDes Modeling
Transistor-level accuracy can be obtained with high capacity channel simulation to predict BER using AMI modeling, even for the most complex EQ architectures
Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card
The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis
IBIS–AMI Modeling Recommendations Conference Presentation
Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems
The focus of this paper is the low frequency portion, including DC, of the spectrum for broadband Sparameters and guidelines to support successful SSO analysis for Chip-Package Board systems.
Effect of Power Noise on Multi-Gigabit Serial Links
This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical printed circuit board (PCB) and package power distribution system (PDS)
IBIS-AMI and Statistical Analysis
AMI models using AMI_GetWave call are incompatible with purely statistical techniques
Efficient Methodology for Modeling Structure of High Speed Long Transmisison Lines
A practical approach for accurately modeling high-speed link structures is presented and named as the “cut and stitch” (C&S) methodology.
Electrical Modeling and Model Representations for Package Interconnects and Power Delivery Networks Conference Presentation
End users require ready access to accurate package models with increasingly complex packages, detailed PI consideration, and higher bandwidth
Effects of Power Ground Via Distribution on the Power Ground Performance of C4 BGA Packages
The effects of the distribution of power and ground vias in C4/BGA type of packages are studied.
Panel Session TP-TU3 High-speed Channel Designs IBIS AMI Solution Conference Presentation
Panel session addressing high-speed channel design challenges
Bridging the Measurement and Simulation Gap