Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

EDM creates the opportunity to help manage the overall electrical design process in addition to helping individual designers and managing design processes. Centrally aggregated WIP designs contain...

As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.

Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.

Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.

This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).

Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression

This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.

Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis

This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical printed circuit board (PCB) and package power distribution system (PDS)

AMI models using AMI_GetWave call are incompatible with purely statistical techniques

A practical approach for accurately modeling high-speed link structures is presented and named as the “cut and stitch” (C&S) methodology.

End users require ready access to accurate package models with increasingly complex packages, detailed PI consideration, and higher bandwidth

The effects of the distribution of power and ground vias in C4/BGA type of packages are studied.

Panel session addressing high-speed channel design challenges

Simulation / Measurement correlation requires accurate modeling of TX/RX/Channel

For upcoming industrial specification of very high speed signals, channel discontinuity and crosstalk become important.