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IBIS–AMI Modeling Recommendations Conference Presentation

October 19, 2018 Cadence PCB Solutions

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Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Gri...

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Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

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IBIS-AMI for SerDes Modeling

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Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis

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Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

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IBIS-AMI and Statistical Analysis

AMI models using AMI_GetWave call are incompatible with purely statistical techniques

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Efficient Methodology for Modeling Structure of High Speed Long Transmisison Lines

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