Cadence Videos

Multiple PCB designers are needed to design complex boards with variety of functionality. And nowadays design teams are dispersed all over the globe, which raises a challenge to compile final design.

There are various routing methods you can utilize to get your designs done faster. Visual notifications help prevent violations and improve design accuracy.

Utilize these techniques to create reliable, powerful and compact designs and ensure the success of your HDI projects.

Inter layer checks help prevent unnecessary design iterations and board re-spins as they help automate the detection of errors.

Utilize embedded components for shorter signal paths, increased performance and reduced PCB size.

Use IPC 2581 to exchange Stack up information. Utilize already existing database stack up for new designs to reduce repetitive manual efforts and human error.

Constraint driven checks, whether electrical, physical, mechanical or manufacturing are all critical to your design process as they help you identify and mitigate potential problems in real-time.

Setting up manufacturing design checks from the beginning helps you easily identify and eliminate any potential issues before they cost you time and money.

By setting up your HDI rules, you can easily fit more parts per board area and pack more power into smaller form factors.

Scribble is a simple routing mode that allows you to ‘draw’ a route path for the trace to automatically follow. It provides a quick two-pick methodology to generate complex route paths, along with ver

Working with your manufacturer and setting up your fabrication, assembly and testing checks from the beginning can help you easily identify and avoid any unexpected problems before they disrupt your p

Identifying potential problems before you finish the design and before you begin the manufacturing process helps reduce costs and eliminate added expenses.

Learn how to quickly and efficiently route around the bends or corners in your PCB design.

Learn how to utilize blind, buried and micro vias to save space and pack power in a more compact HDI design.