OrCAD X Resources

OrCAD X High-Speed Digital Design Guide Part 3

Issue link: https://resources.pcb.cadence.com/i/1534760

Contents of this Issue

Navigation

Page 14 of 16

3. Minimize Inductance: a. Route power traces with minimal loop area by keeping them parallel to ground traces b. Use multiple vias for power connections to reduce inductance c. Ensure short and wide traces for power delivery 4. Perform Power Integrity Analysis: a. Use a power integrity analysis tool such as Celsius PowerDC to analyze the power distribution on a PCB Example of Power Distribution Acceptance Criteria: Core Power (1.2V): ɢ Good: < 3% drop (< 36mV) ɢ Marginal: 3-5% drop ɢ Unacceptable: > 5% drop DDR3 Power (1.5V): ɢ Good: < 4% drop (< 60mV) ɢ Marginal: 4-6% drop ɢ Unacceptable: > 6% drop 15 www.cadence.com OrCAD X High-Speed Digital Design Guide

Articles in this issue

Links on this page

view archives of OrCAD X Resources - OrCAD X High-Speed Digital Design Guide Part 3