Contents
Part 3: Simulation, Analysis, and Verification .......................... 3
Signal Integrity Analysis ................................................................ 3
Signal Integrity Analysis Conditions: ................................ 3
1. DDR3 Parameters: .......................................................... 3
2. Critical Analysis Points: ............................................... 3
Impedance Analysis ............................................................... 3
Coupling Analysis ................................................................... 6
Examples of Signal Integrity Limits: ................................. 7
1. Timing Requirements: ................................................... 7
2. Crosstalk Limits: ............................................................. 7
High-Speed Simulation and Verification .........................8
Signal Reflection Analysis ...............................................8
Eye Diagram Analysis ....................................................... 11
Power Integrity Considerations ........................................ 13
Example of Power Distribution Acceptance Criteria:
............................................................................................... 15
PCB Simulation and Verification Conclusion ................ 16
Lessons Learned and Best Practices ............................. 16
Conclusion ........................................................................................17
2 www.cadence.com
OrCAD X High-Speed Digital Design Guide
