Issue link: https://resources.pcb.cadence.com/i/1517640
ECAD and MCAD Co-Design for Success 2 www.cadence.com The following key requirements highlight the critical aspects necessary for effective collaboration between mechanical and electrical teams to design a high-quality product. MCAD Key Requirements f Accurate Geometry Representation – Ensure proper fitting and alignment of PCB enclosure, housing, and mechanical components f Form Factor Constraints – Critical design constraints are defined as the board outline, thickness, mounting holes, keep-in/keep-out areas, connectors and clearance requirements f Thermal Management Consideration – Implement mechanical design features such as heat sinks, ventilation, and thermal pads to ensure adequate distribution for heat dissipation f Mechanical Stress Analysis – Evaluate the reliability and durability of the final product, and its impact on environmental factors and structural integrity of the PCB assembly ECAD Key Requirements f Electrical Component Consideration – Ensure accurate placement and minimum clearance requirements are met between electrical components and mechanical constraints such as mounting holes, connectors, and keep-in/keep-out areas f Signal Integrity Consideration – Optimize signal integrity with proper component placement and layout techniques to minimize electromagnetic interference (EMI), crosstalk, and impedance mismatches f Power Distribution Planning – Minimize voltage drops and optimize power delivery by proper planning of power distri- bution traces and shapes while simultaneously reducing joule heating f EMI/EMC Compliance – Collaborate with the MCAD team to implement shielding, grounding and more to ensure compliance with EMI and EMC standards Benefits The core benefits of ECAD and MCAD co-design between Cadence and leading MCAD tools are: Effortless Synchronization – Push and pull changes with a single-click with either platform- to-platform or file-based data synchronization Bi-Directional Collaboration – Send object changes from either domain to optimize electrical and mechanical integrity Change History – Accept, reject, and revert change capability with IDX 3D Visualization – Visualize and optimize PCB integration with enclosures early, using advanced 3D capabilities of Allegro X and OrCAD X Platform Connectivity – Supports desktop data exchange and direct connection to Autodesk Fusion and Dassault 3DEXPERIENCE cloud platform Integration Availability – Capability is included in all Allegro X and OrCAD X tiers