Issue link: https://resources.pcb.cadence.com/i/1310905
Sigrity PowerDC Cadence Design Systems enables global electronic design innovation and plays an essential role in the creation of today's electronics. Customers use Cadence software, hardware, IP, and expertise to design and verify today's mobile, cloud and connectivity applications. www.cadence.com © 2017 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and the other Cadence marks found at www. cadence.com /go /trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners. 7882 01/17 SA / SS/ PDF supports grouping of multiple VRMs, and guides you as you increase VRM nominal output voltage to the maximum safe level of compensation. Realistic assessment of critical structures Designs today often include fewer layers, along with higher component, via, and routing densities that combine to reduce the area for power nets. Realistically, planes are not solid but include cutouts and Swiss cheese via fields. Spreadsheet estimations and simple DC and thermal tools are only helpful if margins are ample. Complex designs with multiple sinks, various voltage levels, and irregular plane structures demand highly accurate approaches to avoid field failures such as vias that act like fuses and thermal stress in areas that neck down or have dynamic plane cuts. The Sigrity PowerDC environment accurately simulates the behavior of materials from die attach to copper and important struc- tures such as wirebonds. The electrical/ thermal co-simulation takes accuracy to an even higher level by simultaneously converging on combined current and temperature impacts. Multi-structure analysis Multi-structure analysis provides an intuitive and easy way to perform electrical or electrical/thermal co-simulation for a multi-board system. After the analysis, all detailed results of each block are integrated into a single signoff report. This capability simplifies the setup process and reduces the analysis time, making the DC analysis of a complicated system a practical requirement for your signoff methodology. Integration • Works with Microsoft Windows and Linux • Interfaces to PCB and IC package layout databases from Cadence, Mentor Graphics, Altium, Zuken, and AutoCAD Cadence Services and Support Cadence application engineers can answer your technical questions by telephone, email, or Internet—they can also provide technical assistance and custom training • Cadence certified instructors teach more than 70 courses and bring their real-world experience into the classroom • More than 25 Internet Learning Series (iLS) online courses allow you the flexibility of training at your own computer via the Internet • Cadence Online Support gives you 24x7 online access to a knowledgebase of the latest solutions, technical documentation, software downloads, and more • For more information, please visit www.cadence.com/support-and-training