Issue link: https://resources.pcb.cadence.com/i/1310902
Benefits Use PowerSI to: • Establish power delivery system (PDS) and SI guidelines • Extract fully coupled electrical models of signal, power, and ground networks in IC packages and PCBs for use in time domain simulation of simultaneous switching noise • Fully assess decoupling capacitor strategies and verify placement effects • Evaluate electromagnetic coupling between geometries (planes, traces, and vias) • Extract frequency-dependent impedances or S-parameters directly from PCB, package, and SiP layout data • Anticipate energy leaks with near- and far-field radiation display to reduce downstream electromagnetic interference (EMI)/electromagnetic capability (EMC) challenges • Analyze PDS cavity resonance • Perform DC analysis • Create broadband SPICE models for packages and PCBs with the Sigrity Broadband SPICE ® option Advanced Analysis Techniques Fast and accurate PowerSI efficient electromagnetic analysis techniques are ideal for modeling entire PCBs or IC packages with full-wave accuracy. PowerSI speed stems from unique patented methodologies that allow for auto- adaptive numerical meshes, enabling accurate modeling for complex struc- tures such as cuts and slots in planes, multiple power and ground layers, and any number of vias and traces. PowerSI intelligent multi-processor support distributes simulations for the fastest possible throughput. With an optional high-performance computing license, simulations can be distributed across multiple machines to further enhance throughput. With the PowerSI approach, designers can fully analyze and strategically tune their designs to achieve performance and schedule objectives. The Cadence ® Sigrity ™ PowerSI ® environment provides fast and accurate full-wave electrical analysis of leading-edge IC packages and PCBs to overcome increasingly challenging design issues such as simultaneous switching noise (SSN), signal coupling, problematic decoupling capacitor implementations, and design regions that are under or over target voltage levels. The Sigrity PowerSI approach can be used before layout to develop power integrity (PI) and signal integrity (SI) guidelines as well as post-layout to verify performance and improve designs without a physical prototype. PowerSI capabilities can be readily used in popular PCB, IC package, and system-in-package (SiP) design flows. Cadence Sigrity PowerSI Frequency-domain power- and signal-integrity analysis Figure 1: 3D view of system-level design including IC package and PCB for PDS analysis and SI verification