Issue link: https://resources.pcb.cadence.com/i/1310833
www.cadence.com 2 Cadence 3D Design Viewer 3D wirebond DRC rules. The design data compiled by APD and provided as input to the 3D viewer is saved and can be shared with others using the standalone Cadence 3D Design Viewer, such as manufacturing engineers. The benefits of working with the third dimension are clear when the same design is viewed in 2D and then in 3D. For demonstration purposes a stacked die design using four die on ball grid array (BGA) substrate is used. The base die is flip-chip attached; the top three die are wirebond attached. In the 2D editor view (Figure 2), visualizing and validating the die stack and the wirebond ring is challenging, even for a seasoned package designer. And, due to the complexity, it would be almost impossible to hold a design review with an architect or lead engineer. When the same design is loaded into the 3D Design Viewer (Figure 1) the designer and the engineering team can not only easily visualize, investigate, and create collaborative. markups but they can also perform detailed 3D wirebond checking, including the ability to define, modify, and assign new wirebond profiles. Easy Design Investigation Cross referencing is easy as the 3D Design Viewer uses the same color/layer/object settings as defined in Allegro Package Designer. Layer visualization can be turned on/off and layer transparency set. For detailed design investigation, the 3D Viewer has similar "show element" infor- mation command capability that can be used by "object" or by "net." Importantly, the user has control over the highlight color and the level of transparency applied to none selected objects. The 3D Viewer is especially effective when trying to understand and visualize complex via arrays, especially on designs using build-up layers. Figure 3 illus- trates how difficult it is to understand the connectivity path of high density interconnect (HDI) from a top package substrate layer to a bottom layer viewed in 2D. Contrast this figure with the 3D view of the same HDI. The designer can easily visualize the interconnect path from the top to the bottom layer. Advanced Features When preparing for 3D viewing in SiP Layout or APD, it may be desirable to focus on a sub-section of the package. For this reason, the user is offered the option of taking a section of the package and viewing that piece in the 3D viewer. Figure 3: It is difficult to understand the connectivity path between the metal interconnect as it transitions between layers in 2D Figure 2: A multi-die stack on a BGA substrate viewed in 2D