Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

October 19, 2018 Cadence PCB Solutions

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multi-layered packages are studied. Effects of area-array power and ground vias of different densities are evaluated by examining the input impedances of the package power supply. It is shown that, by properly selecting the density of shorting via arrays, package resonance can be removed from DC to multi-gigahertz frequency range. 

About the Author

Cadence PCB solutions is a complete front to back design tool to enable fast and efficient product creation. Cadence enables users accurately shorten design cycles to hand off to manufacturing through modern, IPC-2581 industry standard.

Follow on Linkedin Visit Website More Content by Cadence PCB Solutions
Previous Flipbook
Power Integrity Conference Paper
Power Integrity Conference Paper

Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation

Next Flipbook
Effect of Power Noise on Multi-Gigabit Serial Links
Effect of Power Noise on Multi-Gigabit Serial Links

This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical pr...


Solving Common Issues in High-Speed Design

First Name
Last Name
Opt-in to future emails and I understand I can unsubscribe at any time.
I agree to the terms of use*
Terms of Use
Thank you!
Error - something went wrong!